Abstract: As the cornerstone of integrated circuit design, the domestic electronic design automation(EDA) industry has developed rapidly in recent years, showing a rapid growth trend in both the number of enterprises and technology coverage. However, from the perspective of the global EDA industry, the coverage of mature domestic EDA tools is not comprehensive enough, and the support capability for advanced processes also needs to be strengthened. As the integrated circuit industry steps into the post-Moore era, new processes such as GAAFET and CFET, new materials such as third-generation semiconductors and two-dimensional materials, and new methods/methodology such as advanced packaging, heterogeneous integration, and STCO, keep emerging. The diversified and complex new application demands represented by automotive electronics, artificial intelligence, intelligent Internet of Things, and 6G communication, such as high bandwidth, high computing power, high reliability, low power consumption, low latency, and low cost, further promote the transformation of integrated circuit design and manufacturing technologies, all of which indicate new development directions for the EDA industry. Meanwhile, the digital world of ubiquitous connectivity is being constructed rapidly. How to deeply integrate with information technologies such as AI technology, cloud technology and even digital twins to facilitate the early advent of the intelligent era is also a development trend that the EDA industry needs to closely monitor.