Abstract: Analog circuits impose increasingly stringent requirements on the accuracy and reliability of resistors, driving higher demands for the absolute precision and thermal stability of resistor components. However, domestically produced high-precision thin-film resistors still significantly lag behind foreign counterparts in terms of yield and consistency. Moreover, a systematic and mature platform for military-grade high-precision thin-film resistor circuits remains underdeveloped. Through research on front-end processes, this study focuses on the structural design and optimization of metal thin-film resistors. By integrating experimental results and wafer fabrication data, a comprehensive analysis is conducted on the impact of equivalent contact resistance and linewidth variations on resistor accuracy. To enhance thermal stability, a low-temperature annealing process for chromium-silicon (Cr-Si) thin films is introduced and optimized, effectively integrating with thermal treatments in back-end processes. This approach improves the thermal stability of the thin-film resistors and achieves thermal compatibility between front-end resistor fabrication and back-end processes such as chip mounting and aging. Key technologies, including high-precision thin-film resistor design and the preparation of high-precision, low-temperature-coefficient Cr-Si films, are successfully developed, ultimately reducing the absolute resistance variation to below 0.3‰.